UV Imaging  (A, B)                                      X-ray Imaging (C, D)

A. MEMS cell/cavity with 100 micron walls
B. Spring feature with 20 micron coil width
Courtesy: Micro Resist Technology GmbH


C. D. Thick SUEX features
Courtesy: Helmholtz-Berlin AZM/BESSY




Wafer Level Packaging
SUEX via fill and etch process

E. Via fill and lithography
F. Exposure: SUSS MA200 broadband
Substrate: 200mm SiOx wafer
Courtesy: JJC Development     Corp.

SUEX TDFS

Preliminary:
Mechanical, Electrical, and Environmental performance specs (after cure at 200C, 30 min)

SUEX TDFS

Composition and Lamination Equipment

.