DJ DevCorp was founded in 2009 to develop new and innovative electronic photoresist material technology for license or sale and to provide product development, process development services and market development activities for the products it develops.
Technologies and products developed by DJ DevCorp are targeted to meet the needs of advanced MEMS manufacturing and wafer level packaging.
We are currently developing Thick Dry Film Sheets (TDFS), which are laminates pre-cut to wafer or substrate dimensions. DJ DevCorp's first offering is the SUEX line of epoxy photoresist sheets, which are offered in a thickness range of 100 microns to more than 1mm. The sheets are readily laminated to substrate surfaces and are ready to use in minutes.
NEW and NOW AVAILABLE
Advanced MEMS manufacturing and wafer level packaging
DJ DevCorp is unique in offering virtually waste-free thick dry film sheets. We are world leaders in High Aspect Ratio thick epoxy photoresist technology.